发明名称 HYBRID PCB OF SOLDERING TYPE
摘要 The present invention relates to technology about a soldering type hybrid printed circuit board capable of easily coupling PCBs by a copper foil part and a soldering part by attaching the copper foil part with a semicircular cross-section to a side part to which the PCBs are connected and soldering the PCBs in the state that the copper foil parts of the PCB facing each other are in contact with each other; and functioning as an electrical signal terminal of control chips mounted on the PCBs. According to the present invention, electromagnetic compatibility (EMC) can be implemented by facilitating an electrical shield case task for preventing electromagnetic interference (EMI) of the control chip mounted on the PCBs connected to each other.
申请公布号 KR101402617(B1) 申请公布日期 2014.06.03
申请号 KR20130028837 申请日期 2013.03.18
申请人 MIR MK CO., LTD. 发明人 MIN, KYEOUNG HWAN
分类号 H05K1/14 主分类号 H05K1/14
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