Backplate interconnect with integrated passives

摘要

This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.

主权项

1. An electronic device, comprising:
a backplate having a recess; at least one electronic component mounted in the recess and in electrical communication with one or more upper electrical traces extending from the electronic component to one or more conductive pads on the backplate; a substrate having one or more electromechanical devices; a seal configured to circumscribe the one or more electromechanical devices and adhere the backplate and the substrate to each other, the seal providing for a sealed area; one or more connection pads inside the sealed area; and one or more pads outside the sealed area, wherein
at least one of the one or more connection pads inside the sealed area has a first electrical connection with one of the one or more conductive pads on the backplate, andat least one of the one or more connection pads inside the sealed area has a second electrical connection with one of the one or more pads outside the sealed area.