Metal substrate and light source device

摘要

The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

主权项

1. A metal substrate comprising a light source mounting surface for mounting a semiconductor chip working as a light source, comprising:
a heat dissipating metal plate comprising a metal except for Au; an insulating resin-made white film stacked on a part of said heat dissipating metal plate; and a light source mounting surface-forming layer stacked on another part of said heat dissipating metal plate,wherein
said light source mounting surface-forming layer is a metal layer which directly contacts said heat dissipating metal plate, and said light source mounting surface is a surface of an Au layer which is the outermost layer of said light source mounting surface-forming layer, and an average reflectance at a wavelength of 400 to 800 nm of said white film is 70% or more.