发明名称 Substrate processing apparatus
摘要 A substrate processing apparatus includes a substrate stage for mounting two or more substrates thereon. The substrate stage includes substrate stage units. Each of the substrate stage units includes a central temperature control flow path for controlling the temperature of a central portion of each of the substrates and a peripheral temperature control flow path for controlling the temperature of a peripheral portion of each of the substrates. The central temperature control flow path and the peripheral temperature control flow path are formed independently of each other. The substrate stage includes one temperature control medium inlet port for introducing therethrough a temperature control medium into the peripheral temperature control flow path and temperature control medium outlet ports for discharging therethrough the temperature control medium from the peripheral temperature control flow path. The number of the temperature control medium outlet ports corresponds to the number of substrates.
申请公布号 US8741065(B2) 申请公布日期 2014.06.03
申请号 US201113172366 申请日期 2011.06.29
申请人 Tokyo Electron Limited 发明人 Odagiri Masaya;Muraki Yusuke;Fujihara Jin
分类号 C23F1/00;H01L21/306;C23C16/00;C23C16/50 主分类号 C23F1/00
代理机构 代理人
主权项 1. A substrate processing apparatus for processing substrates within a vacuum processing space, the substrate processing apparatus comprising: a substrate stage for mounting at least two substrates thereon, the substrate stage including substrate stage units whose number corresponds to the number of the substrates mounted on the substrate stage and a connecting portion coupling the substrate stage units, each of the substrate stage units including a central temperature control flow path for controlling the temperature of a central portion of each of the substrates and a peripheral temperature control flow path for controlling the temperature of a peripheral portion of each of the substrates, the central temperature control flow path and the peripheral temperature control flow path being formed independently of each other, the connecting portion being provided with a temperature control medium inlet port for introducing therethrough a temperature control medium into the peripheral temperature control flow path, and the connecting portion being provided with temperature control medium outlet ports for discharging therethrough the temperature control medium from the peripheral temperature control flow path, the number of the temperature control medium outlet ports corresponding to the number of the substrates mounted on the substrate stage, wherein the peripheral temperature control flow path includes: a peripheral inner flow path connected at one end to the temperature control medium inlet port and arranged to extend along the peripheral portion of each of the substrates;a peripheral outer flow path connected at one end to each of the temperature control medium outlet ports and arranged to extend along the peripheral portion of each of the substrates; anda connection flow path arranged to interconnect the other end of the peripheral inner flow path and the other end of the peripheral outer flow path, the connection flow path and each of the temperature control medium outlet ports being arranged adjacent to the temperature control medium inlet port to interpose the temperature control medium inlet port therebetween.
地址 Tokyo JP