Placing heat sink into packaging by strip formation assembly

摘要

Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.

主权项

1. A method comprising:
placing a plastic film in a compression mold; aligning a metal film over the plastic film; dispersing a molding compound over the metal film; aligning a lead frame assembly over the metal film, wherein the lead frame assembly comprises a plurality of semiconductor devices; and compressing the semiconductor devices into the molding compound to (i) embed the metal film into the molding compound, and (ii) prevent physical contact between the metal film and the lead frame assembly.