Maintaining alignment in a multi-chip module using a compressible structure

摘要

An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

主权项

1. A multi-chip module (MCM), comprising:
a substrate having a first surface and a cavity defined by an edge in the first surface, wherein a bottom of the cavity is vertically offset from the first surface; an island chip having a second surface, wherein the island chip is mechanically coupled to the first surface; a bridge chip having a third surface that faces the second surface, wherein the bridge chip is mechanically coupled to the island chip, and wherein the bridge chip is positioned in the cavity; and a compressible structure positioned between the bottom of the cavity and a fourth surface of the bridge chip which is on an opposite side of the bridge chip from the third surface, wherein the compressible structure includes a compliant material with shape and volume compression, wherein the compressible structure is separate from the substrate, thereby allowing the compressible structure to slide laterally; and wherein the compressible structure provides a force on the bridge chip so that the second surface and the third surface are approximately coplanar without bending the bridge chip.