发明名称 |
Microstructure, micromachine, and manufacturing method of microstructure and micromachine |
摘要 |
Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other. |
申请公布号 |
US8741682(B2) |
申请公布日期 |
2014.06.03 |
申请号 |
US201213414758 |
申请日期 |
2012.03.08 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Yamaguchi Mayumi;Izumi Konami |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a microstructure, comprising the steps of:
forming a separation layer over a first support substrate; forming a first layer over the separation layer; exposing a part of the separation layer; attaching a second support substrate to the first layer with an adhesive layer interposed therebetween;separating the first support substrate from the first layer so that the first remains on the second support substrate;
forming a spacer layer over a first protective substrate; attaching the first layer and the first protective substrate so as to face each other with the spacer layer interposed therebetween; and separating the first layer from the second support substrate further wherein said first support substrate is a light transmitting substrate.
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地址 |
Atsugi-shi, Kanagawa-ken JP |