Evaporation-enhanced thermal management devices, systems, and methods of heat management

摘要

Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like.

主权项

1. A thermal management device, comprising:
a heat dissipater structure disposed on a portion of a heat source structure, wherein the thermal energy from the heat source structure being able to heat at least a portion of the heat dissipater structure, wherein the heat dissipater structure has a heat dissipater surface; a fluid dispenser system adapted to direct fluid droplets towards the heat dissipater structure, wherein the fluid dispenser system is directly attached to the top of the heat dissipater structure at the end opposing the heat source structure, wherein the heat dissipater structure and fluid dispenser system define walls of a plurality of passages, wherein the fluid dispenser system is a top wall of the passages where the fluid dispenser system includes an ejector nozzle directed into the passage at a position on the top wall; and a gas flow system adapted to direct a gas towards the heat dissipater structure, wherein the gas being able to entrain the fluid droplets to form a gas/fluid droplet mixture, wherein the gas/fluid droplet mixture contacts the heat dissipater surface to dispose the fluid droplets onto the heat dissipater surface, and wherein the thermal energy from the heat dissipater surface is capable of being dissipated upon evaporation of the fluid droplets.