发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME
摘要 The present invention relates to a method for manufacturing a printed circuit board and the printed circuit board manufactured thereby. The method for manufacturing the printed circuit board includes the steps of: preparing a base substrate which is composed of an insulation plate and a core layer; forming a resist layer on both sides of the base substrate; forming a via hole and a pattern groove on the base substrate via the resist layer; and forming a via and a circuit pattern by filling the pattern groove and the via hole.
申请公布号 KR20140066442(A) 申请公布日期 2014.06.02
申请号 KR20120133679 申请日期 2012.11.23
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, YOUNG WOONG;KIM, JONG NAM
分类号 H05K3/46;H05K3/40 主分类号 H05K3/46
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