发明名称 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME |
摘要 |
The present invention relates to a method for manufacturing a printed circuit board and the printed circuit board manufactured thereby. The method for manufacturing the printed circuit board includes the steps of: preparing a base substrate which is composed of an insulation plate and a core layer; forming a resist layer on both sides of the base substrate; forming a via hole and a pattern groove on the base substrate via the resist layer; and forming a via and a circuit pattern by filling the pattern groove and the via hole. |
申请公布号 |
KR20140066442(A) |
申请公布日期 |
2014.06.02 |
申请号 |
KR20120133679 |
申请日期 |
2012.11.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, YOUNG WOONG;KIM, JONG NAM |
分类号 |
H05K3/46;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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