| 摘要 |
The present invention relates to a method of mounting a component on a flexible circuit board by using a vacuum absorbing jig apparatus. According to the present invention, provided is a method of mounting a component on a flexible circuit board which includes a vacuum absorbing plate for providing a vacuum absorbing pressure provided from a vacuum providing means; and an absorbing jig plate detachably installed to the top surface of the vacuum absorbing plate and having a recessed jig unit in which one or more vacuum absorbing holes are formed and the flexible circuit board is inserted and mounted at the upper surfaces of each vacuum chamber. The method includes a jig introduction mounting step (S1); a vacuum absorption fixing step (S2); a screen printing step (S3); a surface mounting type component mounting step (S5); a reflow soldering step (S9); and a finished product detaching step (S11). According to the present invention, during a component installing process, several flexible circuit boards are firmly and closely fixed to the jig by repeatedly using vacuum without limiting the number of processes to be advantageous in an automatic process, so that working stability and efficiency may be improved. Furthermore, any residual does not remain in the flexible circuit board even when the jig is detached from the flexible circuit board. In addition, the flexible circuit board is stably supported and fixed by a cover plate in state that the vacuum pressure is removed, so that a process of installing protruding attaching components can be performed. |
