| 摘要 |
<p>A mold for hot stamping is disclosed. The mold for hot stamping according to an exemplary embodiment of the present invention may include an upper mold and a lower mold so as to stamp a heated blank having a welding portion. A recess may be formed at an upper forming surface in the upper mold corresponding to the welding portion of the blank and may define a cooling space between the recess and the blank such that a cooling fluid directly cools the welding portion of the blank after the blank is stamped.</p> |
