| 摘要 |
<p>Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a substrate, a connection member which is formed on the upper surface of the substrate, a semiconductor package which is mounted on the connection member, a sealing material which is formed to fill a space between the upper part of the substrate and the lower part of the semiconductor package, and a shielding material which is formed to cover the sealing material and the semiconductor package.</p> |
