THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要
The present invention relates to a thin-film type chip device. The thin-film type chip device according to an embodiment of the present invention comprises a coil pattern formed on a substrate; a cavity defining pattern having a cavity which exposes a part of the coil pattern; a filling layer filled in the cavity; and a magnetic layer having a surface layer which covers the surface of the filling layer.
申请公布号
KR20140066438(A)
申请公布日期
2014.06.02
申请号
KR20120133667
申请日期
2012.11.23
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, SANG MOON;BAE, JUN HEE;WI, SUNG KWON;KIM, YONG SUK