避免模封溢胶污染至内置散热片之半导体封装构造,申请号TW099127488-传众专利搜索

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发明名称	避免模封溢胶污染至内置散热片之半导体封装构造
摘要
申请公布号	TWI440146	申请公布日期	2014.06.01
申请号	TW099127488	申请日期	2010.08.17
申请人	力成科技股份有限公司新竹县湖口乡新竹工业区大同路26号	发明人	黄子瑜;王崇圣
分类号	H01L23/28	主分类号	H01L23/28
代理机构		代理人	许庆祥高雄市前镇区复兴四路12号3楼之7
主权项
地址	新竹县湖口乡新竹工业区大同路26号

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