半导体之气隙的制作方法及其结构,申请号TW100135719-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	半导体之气隙的制作方法及其结构
摘要
申请公布号	TWI440134	申请公布日期	2014.06.01
申请号	TW100135719	申请日期	2011.10.03
申请人	瑞晶电子股份有限公司台中市后里区三丰路429之1号	发明人	松田拥
分类号	H01L21/764	主分类号	H01L21/764
代理机构		代理人	黄志扬台北市中山区长安东路1段23号10楼之1
主权项
地址	台中市后里区三丰路429之1号

您可能感兴趣的专利

3-AMINO-INDAZOLE OR 3-AMINO-4,5,6,7-TETRAHYDRO-INDAZOLE DERIVATIVES

GUANYLYL CYCLASE C IN THE DETECTION OF STOMACH AND ESOPHAGEAL CANCERS

FUEL CELL AND METHOD FOR ITS PRODUCTION

SIDERAIL SUPPORT MECHANISM WITH OBLONG PIVOT SLOT

Wireless transmitting apparatus for a vehicle having a plurality of low frequency antennas

SUTURE ANCHOR WITH PULLEY

WIRE PEGBOARD AIR TOOL HOLDER HOOK

PROCESS FOR THE BENEFICIATION OF SULFIDE MINERALS

A BLADE FOR A WIND TURBINE AND A METHOD OF ASSEMBLING LAMINATED PROFILES FOR A BLADE

COMPOSITION FOR PROMOTING STEM CELL PROLIFERATION COMPRISING VEGETABLE PEPTONE

Rotor blades and nacelle

MATERIAL PLATE WITH A GRAPHIC SURFACE STRUCTURE

METHOD AND APPARATUS FOR ANTENNA MAPPING SELECTION IN MIMO-OFDM WIRELESS NETWORKS

HOLD-DOWN DEVICE FOR PLATE SHEARS

FLEXIBLE LEATHER LAMINATE

A METHOD TO QUANTITATIVELY ANALYZE CONJUGATED DIENES IN HYDROCARBON FEEDS AND PRODUCTS AS AN INDICATOR OF FOULING POTENTIAL

KNIFE FIXING METHOD