使用薄晶粒和金属基材之半导体晶粒封装,申请号TW096110344-传众专利搜索

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发明名称	使用薄晶粒和金属基材之半导体晶粒封装
摘要
申请公布号	TWI440151	申请公布日期	2014.06.01
申请号	TW096110344	申请日期	2007.03.26
申请人	快捷半导体公司美国	发明人	耶玛兹　汉查;莎普　史蒂芬;王琦;励敏华;墨菲　詹姆斯Ｊ. MURPHY, JAMES J. US;迪洛尔　约翰Ｒ. DIROLL, JOHN ROBERT US
分类号	H01L23/492;H01L23/49;H01L21/60	主分类号	H01L23/492
代理机构		代理人	恽轶群台北市松山区南京东路3段248号7楼;陈文郎台北市松山区南京东路3段248号7楼
主权项
地址	美国

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