半导体封装之多基板平板模封方法,申请号TW098133487-传众专利搜索

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发明名称	半导体封装之多基板平板模封方法
摘要
申请公布号	TWI440102	申请公布日期	2014.06.01
申请号	TW098133487	申请日期	2009.10.02
申请人	力成科技股份有限公司新竹县湖口乡新竹工业区大同路26号	发明人	范文正
分类号	H01L21/56;H01L25/04	主分类号	H01L21/56
代理机构		代理人	许庆祥高雄市前镇区复兴四路12号3楼之7
主权项
地址	新竹县湖口乡新竹工业区大同路26号

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