发明名称 MULTILAYER PCB VOICE COIL PLATE IMPROVING SOUND PRESSURE OF FLAT PANEL SPEAKER
摘要 <p>The present invention relates to a flat panel speaker and, more particularly, to a flat panel speaker having improved sound pressure by altering the shape of the voice coil to incorporate a pattern or a wound voice coil plate. A multilayer PCB voice coil plate that improves the sound pressure of a flat panel speaker according to the present invention is a multilayer PCB (Printed Circuit Board) voice coil plate printed in a voice coil pattern form interposed between a pair of magnetic bodies used in a flat panel speaker, wherein the voice coil plate is printed on a PCB in the form of a multilayer pattern track-type voice coil, and the voice coil is formed with a plurality of through-holes in the PCB regions in which the pattern is not formed.</p>
申请公布号 WO2014081156(A1) 申请公布日期 2014.05.30
申请号 WO2013KR10384 申请日期 2013.11.15
申请人 EXELWAY INC. 发明人 KIM, DONG-MAN
分类号 H04R9/04;H05K1/16 主分类号 H04R9/04
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