发明名称 |
FRAMELESS ULTRASOUND PROBES WITH HEAT DISSIPATION |
摘要 |
<p>Amatrix array ultrasound probe having a sensor module with an array transducer and a beamformer ASIC is assembled without a sensor module frame. The sensor module is held in place in the probe by a surrounding heatspreader, which not only retains the sensor module in place but also provides peripheral heat transfer away from the array transducer and ASIC and RFI/EMI shielding of the sensor module.</p> |
申请公布号 |
WO2014080312(A1) |
申请公布日期 |
2014.05.30 |
申请号 |
WO2013IB59991 |
申请日期 |
2013.11.08 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
CUSCUNA, DINO FRANCESCO;PAOLINO, JAMES FRANCIS |
分类号 |
A61B8/00;G01S7/52;G01S15/89 |
主分类号 |
A61B8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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