发明名称 FRAMELESS ULTRASOUND PROBES WITH HEAT DISSIPATION
摘要 <p>Amatrix array ultrasound probe having a sensor module with an array transducer and a beamformer ASIC is assembled without a sensor module frame. The sensor module is held in place in the probe by a surrounding heatspreader, which not only retains the sensor module in place but also provides peripheral heat transfer away from the array transducer and ASIC and RFI/EMI shielding of the sensor module.</p>
申请公布号 WO2014080312(A1) 申请公布日期 2014.05.30
申请号 WO2013IB59991 申请日期 2013.11.08
申请人 KONINKLIJKE PHILIPS N.V. 发明人 CUSCUNA, DINO FRANCESCO;PAOLINO, JAMES FRANCIS
分类号 A61B8/00;G01S7/52;G01S15/89 主分类号 A61B8/00
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