TOUCH PANEL, BONDING DEVICE FOR CIRCUIT SUBSTRATE, AND METHOD FOR BONDING CIRCUIT SUBSTRATE USING THE SAME

摘要

The present invention discloses a touch panel, a circuit substrate bonding device, and a method thereof. The touch panel comprises a window including one surface and the other surface having curvature; a sensing electrode formed at one surface of the window; a wiring part electrically connected to the sensing electrode; a first pattern part electrically connecting the wiring part to the circuit substrate and delivering a sensing signal sensed by the sensing electrode to the circuit substrate; and an anisotropic conductive film electrically connecting the first pattern part to a second pattern part by being interposed the circuit substrate including the second pattern part formed correspondingly to the first pattern part and the first pattern part wherein the first pattern part and the second pattern part are electrically connected based on pressurizing the anisotropic conductive film interposed between the one surface of the window and the circuit substrate by exerting power to the circuit substrate from upper side of the one surface of the window with the other surface of the window being settled.