发明名称 PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD
摘要 <p>A main wire 111 has inner layer wiring patterns 161 to 165 which are wired on an inner layers 114 and 115 connected by via conductors 166 to 169 in series. In addition, a main wire 112 has inner layer wiring patterns 181 to 185 which are wired on the inner layers 114 and 115 connected by via conductors 186 to 189. The inner layer wiring patterns 161 to 165 and the inner layer wiring patterns 181 to 185 are wired so as to change the layer to the inner layer on the opposite side to each other. Branch wires 1211 to 1214 and 1221 to 1224 are branched from the via conductors 166 to 169 and 186 to 189, respectively. Thereby, the present invention provides an inexpensive printed wiring board which can reduce ringing without upsizing the printed wiring board.</p>
申请公布号 WO2014080963(A1) 申请公布日期 2014.05.30
申请号 WO2013JP81333 申请日期 2013.11.14
申请人 CANON KABUSHIKI KAISHA 发明人 NUMAGI, TAKASHI;NOMURA, HIKARU;KIKUCHI, MASANORI;MIZUNO, HIROYUKI
分类号 H05K1/02;G11C5/06;H05K1/11;H05K3/42 主分类号 H05K1/02
代理机构 代理人
主权项
地址