SURFACE-TREATED ELECTROLYTIC COPPER FOIL, LAMINATE, AND PRINTED CIRCUIT BOARD

摘要

Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrolytic copper foil for which the roughness (Rz) of the roughened surface of the copper foil measured using a stylus-type roughness meter is 2.0 µm or less and the kurtosis (Sku) of the roughness curve of the roughened surface is 2-4.