| 摘要 |
An apparatus for processing a substrate is disclosed. According to the present invention, in the apparatus for processing a substrate, a support shaft formed in a door penetrates the support hole of an insulating board. The lower surface of the insulating board is supported by a support block installed in the door and separated to an upper side by a constant distance. Even if the insulating board is bent in a lower direction by its own weight, the inner surface of the support hole does not come in contact with the outer surface of the support shaft. A concentrated load caused by the support shaft is not applied to a part of the insulating board forming the support hole, so damage to the insulating board is prevented. |
