HIGHLY FILLED HIGH THERMAL CONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING SAME, COMPOSITION, COATING LIQUID AND MOLDED ARTICLE

摘要

Provided are a highly filled high thermal conductive material, etc. which effectively utilize the features of and improve defects of an organic polymer, are capable of integrally molding with ceramics, metal, semiconductor elements, etc., and have a low thermal expansion coefficient and a high thermal conductivity. This highly filled high thermal conductive material is formed by press forming a composition at a temperature that is equal to or higher than the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm2, and cooling and solidifying the same. The composition comprises organic polymer particles and a thermal conductive filler that has a graphite-like structure, and with respect to a 100 weight% of a total thereof, comprises 5 to 60 weight% of the organic polymer particles and 40 to 95 weight% of the thermal conductive filler that has a graphite-like structure. From the composition, the thermal conductive filler is dispersed and obtained by delamination while maintaining the average surface particle size of the thermal conductive filler and a thermal conductive infinite cluster is formed.