| 摘要 |
<p>Disclosed is a method for cutting nonmetal substrates to create an initial crack with a uniform length at all times. The method for cutting nonmetal substrates comprises the steps of: aligning a camera to position an aligning mark in the center of the image obtained from the camera; determining whether the center of the image of the aligning mark is identical with the center of the camera image by obtaining the aligning mark image from the camera via a control unit after setting nonmetal substrates on a table; correcting the starting position of the initial crack on the nonmetal substrates by moving an initial cracker via the control unit if the center of the aligning mark image is not identical with the center of the camera image; creating the initial crack using the initial cracker on the part in which cutting of the cutting line of the nonmetal substrates begins; and cutting the nonmetal substrates at the point of the initial crack by forming a scribing line on the nonmetal substrates by irradiating a laser beam on the nonmetal substrates via an optical heating instrument. [Reference numerals] (AA) Start;(BB) Ene;(S110) Camera alignment;(S120) Align mark imaging center matches for an camera imaging center?;(S130) Correct initial cracks start position;(S140) Form initial crack formation on a non-metallic substrate;(S150) Cut non-metallic substrate by forming scribing lines on the non-metallic substrate</p> |
