ELECTRONIC COMPONENT DEVICE MANUFACTURING METHOD, AND ELECTRONIC COMPONENT DEVICE

摘要

This electronic component device manufacturing method includes: a step for preparing a mounting substrate having an electronic component connected thereto in a face-down state; a step for obtaining a laminated body by disposing a sheet-like thermosetting resin composition on the electronic component; a step for pressing the laminated body in a chamber in a depressurized state; and a step for pressurizing the laminated body in a chamber in a high pressure-state, said laminated body having been pressed.