发明名称 DEVICE FOR COOLING A SUPPORTING STRUCTURE OF A HEAT SHIELD, AND HEAT SHIELD
摘要 The invention relates to a device (20, 29, 48, 64) for cooling a supporting structure of a heat shield (33, 60). With the device for cooling a supporting structure of a heat shield, scaling of the supporting structure due to the intake of hot gas can be particularly effectively avoided. For this purpose, the device comprises a longitudinal axis (21) and a cooling air duct (22), wherein the device can be arranged on the supporting structure with the longitudinal axis (21) perpendicular to the surface (51) of the supporting structure (34), and, in this position, the cooling air duct (22) extends from a device end (23) pointing towards the supporting structure and comprises at least one outlet duct downstream, wherein the at least one outlet duct emerges out of the device (20, 29, 48, 64) laterally with respect to the longitudinal axis (21), and the cooling air duct (22) corresponds to at least one cooling air passage (50) arranged in the supporting structure (34).
申请公布号 WO2014044654(A3) 申请公布日期 2014.05.30
申请号 WO2013EP69215 申请日期 2013.09.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 GRENDEL, SABINE;KLUGE, ANDRE
分类号 F23M5/08;F23M5/04;F23R3/00;F23R3/60 主分类号 F23M5/08
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