<p>A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.</p>
申请公布号
WO2014081590(A1)
申请公布日期
2014.05.30
申请号
WO2013US69730
申请日期
2013.11.12
申请人
APPLIED MATERIALS, INC.
发明人
DAVID, JEFFREY DRUE;SWEDEK, BOGUSLAW A.;BENNETT, DOYLE E.;OSTERHELD, THOMAS H.;CHERIAN, BENJAMIN;BENVEGNU, DOMINIC J.;LEE, HARRY Q.;D'AMBRA, ALLEN L.;RANGARAJAN, JAGAN