| 摘要 |
The present invention is provided to manufacture an electronic device member which suppresses exfoliation of a sealer or damage to a substrate. A manufacturing method of electronic device member of the present invention includes a lamination process, a curing process and an exfoliation process. In the lamination process, a pair of laminates are laminated by disposing first and second sealers under reduced pressure. The pair of laminates have a substrate with a film thickness of 0.3 mm which has at least one device forming region on which a electronic device is formed and a reinforcement plate which is exfoliation-capably bonded to the substrate. The first sealer is arranged around the device forming region in between the pair of laminates. The second sealer is arranged in the outside of the first sealer in between the pair of laminates. In the curing process, the pair of laminates are bonded by the first and second sealers by curing the first and second sealers. In the exfoliation process, the reinforcement plate is exfoliated from the substrate. The second sealer has a frame shape and does not have the first sealer inside of the frame shape. Also, the second sealer is installed to suppress the exfoliation of the first sealer and damage to the substrate in the exfoliation process. |
