| 摘要 |
Disclosed are a semiconductor device manufactured using a paper as a substrate and a method of manufacturing the same. According to an embodiment of the present invention, the semiconductor device is manufactured by using a paper including pulp as a raw material or paper as a substrate coated with a heat-resistant material such as silicon. According to the present invention, a metal wiring layer such as a gate electrode is formed on the paper substrate by using a vacuum deposition method, or the like and an insulating layer is stacked thereon. |
