PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF

摘要

Disclosed are a finger print sensor package and a manufacturing method thereof capable of manufacturing ultra-thin finger print sensor of which the width is 500μm or less by not using a separate PCB. According to an embodiment of the present invention, the finger print sensor package comprises: a first surface in which a plurality of bond pads and a sensor are formed; a semiconductor die including a second surface facing the first surface and covered by an encapsulated unit; a first passivation layer in which an opening for exposing the bond pad by being patterned and covering the first surface of the semiconductor die; a first RDL electrically connected to the exposed bond pad through the first passivation layer; a via penetrating the encapsulated unit and electrically connected to the first RDL; a second RDL electrically connected to the via and formed at the upper part of the encapsulated unit; and an LGA exposing the second RDL and electrically connected to the second RDL exposed through the second passivation layer covering the second RDL and encapsulated unit.