SIDE VIEW-TYPE LED PACKAGE, LIGHTING ARRAY MODULE INCLUDING SAME, AND METHOD FOR MANUFACTURING SAME

摘要

A side view-type LED package, a lighting array module using the same, and a method for manufacturing the same are disclosed. The method for manufacturing a lighting array module, according to the present invention, comprises the steps of: forming a fluorescent layer on a front side of a substrate such that an upper side of the substrate and a lateral side and an upper side of an LED chip can be included therein; and forming N side view-type LED packages by cutting the substrate in substrate units of the N LED packages, so that an angle of beam spread can be enlarged and the number of LED packages of a lighting array module can be reduced.