| 摘要 |
A bonding method of a ceramics substrate and a metal foil is provided to improve the reliability of a process by increasing bonding strength of the ceramics substrate and the metal foil and to realize simplification of a process and a cost reduction. A bonding method of a ceramics substrate and a metal foil includes the steps of: printing a thick film(110) on the ceramics substrate using conductive paste(120) with a predetermined filler powder; drying the thick film printed on the ceramics substrate at a temperature ranging from 60 to 80°C for 8 ~ 12 minutes; and stacking the metal foil on the dried thick film and heating a resultant object under inert atmosphere at a temperature ranging from 1050 to 1083°C for 1 ~ 60 minutes. The filler powder uses at least one of Ag, Ti, Ni, Cu, CuO, Cu20, or AgO. The filler power has granularity of 0.1 to 10.0 um. The metal foil is a copper foil, the ceramics substrate is an aluminum substrate(100), and the filler power is Cu2O. |
