发明名称 |
GROUND CONTACT OF AN INTEGRATED CIRCUIT TESTING APPARATUS |
摘要 |
A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material. |
申请公布号 |
SG2013075825(A) |
申请公布日期 |
2014.05.29 |
申请号 |
SG20130075825 |
申请日期 |
2013.10.10 |
申请人 |
JF MICROTECHNOLOGY SDN. BHD. |
发明人 |
FOONG, WEI KUONG;GOH, KOK SING;SHAMAL MUNDIYATH;LEE, ENG KIAT |
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