| 摘要 |
The present invention relates to a heating pipe for a semiconductor manufacturing apparatus. The objective of the present invention is to configure a ventilating pipe connected between a process chamber and a scrubber in a flexible bellows tube shape, to enable a temperature of exhaust gas to be increased to a desired temperature while preventing a temperature drop, and to enable maintenance of a heating member or an insulation member. The heating pipe for a semiconductor manufacturing apparatus comprises a ventilating pipe (10), wherein connecting units (11) to which a pump and a scrubber are connected are formed at both ends and a flexible tube type bellows portion (12) is formed between the connecting units; a heating unit (20) which is formed on an outer surface of the bellows portion (12) in order to heat an inner space of the bellows portion (12) and electrically emits heat; and a fixing unit (30) which fixes the heating unit (20) on the ventilating pipe (10). Heating lines (21) of the heating unit (20) are wound on the outer surface of the bellows portion (12) in a spiral shape, wherein a space between the heating lines (21) increases from an exhaust gas input portion to an output portion. |
