LIGHT EMITTING DEVICE PACKAGE APPARATUS, LIGHT EMITTING DEVICE PACKAGE MODULE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a light emitting device package apparatus, a light emitting device package module, and a manufacturing method of the light emitting device package apparatus. The light emitting device package apparatus of the present invention includes: a substrate; a light emitting device mounted on the substrate and having a terminal layer formed on an upper surface; a first translucency encapsulation layer made by a insulating material to cover the light emitting device; a first penetration electrode formed through the first translucency encapsulation layer on the terminal layer; and a first wiring layer connected to the first penetration electrode and installed on the upper surface of the first translucency encapsulation layer. Therefore, the present invention enables collective light emitting device packaging work and electrical connection work of the light emitting devices, thereby reducing product costs and increasing high productivity, large capacity, large area, high resolution, and a broad range of applications.