METHOD OF FINISHING SIDE SURFACES OF TRANSPARENT SUBSTRATE FOR DISPLAY DEVICE AND FINISHING APPARATUS USING SAME

摘要

The present invention relates to a side processing method of a transparent substrate for a display device and a processing device using the same. The present invention provides the side processing method of the transparent substrate for the display device and the processing device using the same comprising; a substrate cutting step of cutting a large sized substrate to become a transparent substrate of the size which is used in the display device; a cutting surface finishing step of finishing a cutting surface by irradiating the cutting surface with a first laser beam as the state in which the center of the first laser beam moves along a central path flowing the cutting surface of the transparent substrate; and a chamfer forming step of forming a chamfer which is inclined along one border of the cutting surface by irradiating the cutting surface with a second laser beam as the state in which the center of the second laser beam moves along one-sided path on the cutting surface which is one-sided towards a plane surface of the transparent substrate from a central line of the transparent substrate. The side processing method of the transparent substrate for the display device and the processing device using the same accurately processes the side of the transparent substrate within a short time with a high yield rate capable of minimizing a repetition rate of a fine crack.