| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate in which a warp of a semiconductor package substrate does not occur when a semiconductor component is soldered to the semiconductor package substrate using a solder reflow device, a semiconductor package substrate jig and a method of soldering a semiconductor component to a semiconductor package substrate.SOLUTION: There is provided a semiconductor package substrate 31 for performing flip-chip mounting of a semiconductor component 33. In the semiconductor package substrate, a build-up wiring conductor on the outermost surface on the rear side of the surface on which the semiconductor component 33 is mounted consists of a ferromagnetic body. |
