发明名称 COPPER PLATING LAYER-FITTED ROLLED COPPER FOIL
摘要 <p>PROBLEM TO BE SOLVED: To impart excellent elasticity to rolled copper foil after a recrystallization annealing step.SOLUTION: The invention comprises: a rolled copper foil made of oxygen-free copper or a thin tin copper alloy using oxygen-free copper as a mother phase; and a copper plating layer formed on at least one side face of the main surface of the rolle copper foil or its rear face, and, in a state where the rolled copper foil is refined to re-crystals, at least a part of the crystal grains of the copper plating layer is integrated with the refined crystal grains of the rolle copper foil.</p>
申请公布号 JP2014098179(A) 申请公布日期 2014.05.29
申请号 JP20120249611 申请日期 2012.11.13
申请人 SH COPPER PRODUCTS CORP 发明人 MUROGA TAKEMI;GOTO CHIZURU;SEKI SOSHI
分类号 C25D5/50;C22C9/00;C22C9/02;C22F1/00;C22F1/08;C25D7/06;H05K1/09 主分类号 C25D5/50
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