| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit package structure capable of establishing communication between controllers by means of DC insulation employing magnetic coupling between parts of lead frames.SOLUTION: An integrated circuit package includes an encapsulation part and a lead frame. A part of the lead frame is disposed in the encapsulation part. The lead frame includes a first conductor having a first conduction loop substantially disposed in the encapsulation part. The lead frame also includes a second conductor DC insulated from the first conductor. The second conductor includes a second conduction loop, substantially disposed in the encapsulation part, arranged adjacent to the first conduction loop, and being magnetically coupled to the first conduction loop, for providing a communication link between the first conductor and the second conductor. |
