| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that when, after a plating layer for plating an external terminal electrode is formed by applying, for example, copper plating to an end face of a component body having each end part of an internal electrode exposed, heat treatment at a temperature of 1000°C or above is applied in order to improve the adhesion strength and the moisture resistance of the external terminal electrode, fusing occurs in part of the plating layer, resulting in the fastening strength of the plating layer being deteriorated.SOLUTION: A surface modulus (= three-dimensional area/two-dimensional area) of plating layers 10, 11 is made to be 1.01 or greater. This makes it possible to ensure that, in a process in which a component body 2 having the plating layers 10, 11 formed therein is heat-treated at a temperature of 1000°C or above, fusing due to the heat-treatment of the plating layers can be almost completely prevented while maintaining the strength of fastening between the plating layers 10, 11 and the component body. Also, because the surface modulus of the plating layers 10, 11 is kept high without being lowered, adhesion with plating layers 12, 13 further on top thereof can be heightened.</p> |
