| 摘要 |
PROBLEM TO BE SOLVED: To provide an art favorable to prevent a damage on a micro lens in a manufacturing stage.SOLUTION: A solid state image pickup device manufacturing method comprises the steps of: preparing a structure including a semiconductor layer which has a first surface and a second surface and includes a photoelectric conversion part, and a pad electrode arranged on the semiconductor layer on the first surface side; forming an organic film including a micro lens on the structure on the second surface side of the semiconductor layer; forming an inorganic film on the organic film; forming a resist pattern having a first opening on the inorganic film; forming a second opening in the inorganic film through the first opening of the resist pattern; processing the structure through the second opening of the inorganic film to form a third opening in the structure for exposing the pad electrode; and removing the resist pattern. |
