发明名称 METHOD FOR SHORTENING VIA STUB AND PRINTED CIRCUIT BOARD DESIGNED BASED ON THE METHOD
摘要 A method for shortening a via stub includes: designing a first via hole to connect signal lines of a top layer and a bottom layer of a printed circuit board; and designing a second via hole to connect signal lines of the bottom layer and one of a number of middle layers of the printed circuit board. The printed circuit board include n layers, n is an even number, and the number of the one of the number of middle layers counting top down or bottom up is less than or equal to n/2. A related printed circuit board is also provided.
申请公布号 US2014144691(A1) 申请公布日期 2014.05.29
申请号 US201313736083 申请日期 2013.01.08
申请人 HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO.;HON HAI PRECISION INDUSTRY CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO. 发明人 WEI MING;PAI CHIA-NAN;HSU SHOU-KUO
分类号 H05K1/02;G06F17/50 主分类号 H05K1/02
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