发明名称 |
METHOD FOR SHORTENING VIA STUB AND PRINTED CIRCUIT BOARD DESIGNED BASED ON THE METHOD |
摘要 |
A method for shortening a via stub includes: designing a first via hole to connect signal lines of a top layer and a bottom layer of a printed circuit board; and designing a second via hole to connect signal lines of the bottom layer and one of a number of middle layers of the printed circuit board. The printed circuit board include n layers, n is an even number, and the number of the one of the number of middle layers counting top down or bottom up is less than or equal to n/2. A related printed circuit board is also provided. |
申请公布号 |
US2014144691(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201313736083 |
申请日期 |
2013.01.08 |
申请人 |
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO.;HON HAI PRECISION INDUSTRY CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO. |
发明人 |
WEI MING;PAI CHIA-NAN;HSU SHOU-KUO |
分类号 |
H05K1/02;G06F17/50 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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