发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device that dispenses with use of an adhesive tape with high adhesive strength during cutting and that makes a package substrate after the cutting stuck on the adhesive tape to assume a form attached to a frame.SOLUTION: An adhesive tape sticking mechanism includes a roller member that forms a package substrate unit by sticking an adhesive tape of an annular frame body on a package substrate by rolling on the annular frame body loaded on the cut package substrate held by a stage, and accommodation means for accommodating the package substrate unit in a second cassette by carrying out the formed package substrate unit from the top of the stage.
申请公布号 JP2014099435(A) 申请公布日期 2014.05.29
申请号 JP20120248919 申请日期 2012.11.13
申请人 DISCO ABRASIVE SYST LTD 发明人 TANAKA MANPEI
分类号 H01L21/301;H01L21/56;H01L21/683 主分类号 H01L21/301
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