| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which inhibits the occurrence of poor mechanical and electrical connection by inhibiting occurrence of variation in thickness of a conductive adhesive.SOLUTION: A semiconductor device including a semiconductor chip (10), a lead (20) and a conductive adhesive (30) for mechanically and electrically connecting the semiconductor chip and the lead comprises a plurality of salients (40) which are formed on at least either of an opposite face (11b) of the semiconductor chip with the lead or an opposite face (20a) of the lead with the semiconductor chip to extend from the one opposite face to the other opposite face and have the same lengths with each other, in which respective ends of the plurality of salients is brought into contact with the respective opposite faces of the semiconductor chip and the lead and the plurality of salients define a thickness of the conductive adhesive which is provided between the semiconductor chip and the lead and brought into contact with the respective opposite faces of the semiconductor chip and the lead.</p> |
