WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To easily control thickness of plating of through hole inner walls in accordance with a difference in heat dissipation properties between through holes in a wiring board which dissipates heat via the plating of the through hole inner walls.SOLUTION: Through holes comprise a first through hole (30) and a second through hole (31) different in heat dissipation properties. In the first through hole (30) having higher heat dissipation properties, plating (32) is formed by laminating two or more layers. In the second through hole (31) having lower heat dissipation properties, plating (33) is constituted of only one layer. The total thickness of the plating (32) formed of the two or more layers in the first through hole (30) is larger than the thickness of the plating (33) in the second through hole (31).