发明名称 |
DATA TRANSMISSION THROUGH OPTICAL VIAS |
摘要 |
Technologies generally described herein relate to multilayer circuit boards with optical vias for data transmission between the layers. One or more regions may be created on a multilayer circuit board for optical vias. A transparent conducting oxide (TCO) layer can be deposited on a top and/or bottom layer of the circuit board. P-N junctions can be created over the TCO layer about the one or more regions to form optical vias as photo-emitting and/or photo-detecting components. The photo-emitting and/or photo-detecting components may be coupled to electronic components on the multilayer circuit board. |
申请公布号 |
US2014145189(A1) |
申请公布日期 |
2014.05.29 |
申请号 |
US201414169145 |
申请日期 |
2014.01.30 |
申请人 |
EMPIRE TECHNOLOGY DEVELOPMENT, LLC |
发明人 |
SIEVERS MICHAEL RAY |
分类号 |
H01L31/173;H01L31/032;H01L31/18;H01L33/26 |
主分类号 |
H01L31/173 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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