| 摘要 |
An integrated circuit die stack comprises a first die and a second die connected to each other. Each of the first and second dies comprise a functional circuitry, a plurality of first contacts on a first surface of the respective die, a plurality of second contacts on a second surface of the respective die, and a programmable array coupled to the functional circuitry and the plurality of first and second contacts. The programmable array includes a plurality of programmable connection elements in the first and second dies. The programmable connection elements are programmed to bypass one of the first and second dies. |
