SEMICONDUCTOR MEMORY CHIP AND STACKED SEMICONDUCTOR PACKAGE INCLUDING THE SAME

摘要

The present invention provides a semiconductor memory chip and a stacked semiconductor package including the same. The semiconductor memory chip includes a memory chip which includes first data pads closely arranged in first side and first command/address pads, and a second data pads closely arranged in a second side facing the first side and second command/address pads, and a package substrate which includes first CA contact pads which are connected to the first command/address pads and have an upper surface where the memory chip is mounted, and second CA contact pads which are connected to the second command/address pads and face the first CA contact pads.