CONDUCTIVE ENCAPSULATION FILM FOR OLED

摘要

The present invention relates to a conductive encapsulation film for an OLED which comprises an optical film layer, and a grid-shaped silicon binder resin layer which is applied to the upper surface of the optical film layer, wherein the grid-shaped silicon binder resin layer includes a conductive filler. The conductive encapsulation film for an OLED according to the present invention has excellent adhesive properties for the an OLED substrate, can prevent a substrate including the OLED from an external impact, and has excellent heat, generated from the OLED element, release characteristics.